Soldering Paste 10CC RMA-223-UV BGA Solder Paste Flux

Product Features:
 
Good immersion and high intensity joint.
Easy to peel off with hands or tweezers, leave no residue.
Won't oxidating gold, copper, phosphorus, bronze, oxidation.
Prevent contamination during assembly.
RMA-223: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips.
RMA-223 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
High soaking ,high strength joints.
No-toxic, no-corrosive, strong ability of insulation.
Good insulation and smooth welding surface.
No deterioration no dry.
No poison no orrosion, no damage to parts.
It is currently the best on the market BGA, CSP rework help paste.